Epitaxial and polycrystalline growth of AlN by high temperature CVD. Experimental results and simulation.

AlN growth by HTCVD (high temp. CVD) from AlCl3 and NH3 is currently a promising way to obtain thick, compact layers of AlN. This study focused on the development of a kinetic mechanism that models AlN growth with only 7 gas-phase reactions and 4 surface reactions. Ab initio estn. of the thermodn. data of the AlCl2NH2, AlClNH, AlCl(NH2)2, and Al(NH2)3 intermediates suspected to be involved in the gas-phase reactions is proposed. Only AlCl2NH2 is present in noticeable concns. under our exptl. conditions. Expts. made at different temps. and N/Al ratios, carried out in a cold wall HTCVD reactor, were used to validate the proposed model. Finally, the N/Al ratio in the gas phase was obsd. to play a key role in the AlN surface quality. Possible explanations of this influence and future expts. that will confirm this trend are discussed. [on SciFinder(R)]

Références

Titre
Epitaxial and polycrystalline growth of AlN by high temperature CVD. Experimental results and simulation.
Type de publication
Article de revue
Année de publication
2010
Revue
Surf. Coatings Technol.
Volume
205
Pagination
1294–1301
ISSN
0257-8972
Soumis le 12 avril 2018